Name: N12 Intel CPU Cooler 1U LGA4189-4-5 P4-P5 od P+ Cooler Copper with Vapour Chamber active with PW
Brand: Dynatron
SKU: 21270350
Price: 78.39 EUR
Availability: InStock

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Dynatron

The Dynatron N12 is a processor cooling solution for Intel LGA4189 sockets, featuring an integrated fan for efficient heat dissipation. This CPU cooler maintains the thermal performance of compatible Intel processors at an optimal level through a compact design suitable for standard case configurations. The cooling system employs a heatsink with aluminum fins to increase surface area for heat transfer and a direct contact base for effective thermal conductivity between the processor and the cooler. The included fan ensures reduced processor temperatures during demanding computing tasks with balanced airflow, supporting system stability and longevity. Measuring approximately 120 mm in height, 95 mm in width, and 80 mm in depth, the N12 provides a practical cooling solution for workstations and servers that require reliable thermal management. Weighing around 450 g, it facilitates easy installation. Mounting is done via a standard fastening mechanism for LGA4189 sockets with simple tools for secure attachment. This successor model to previous Dynatron cooling designs integrates refined technology for consistent performance in environments with critical processor cooling needs. The construction focuses on durability with materials that ensure thermal efficiency and structural integrity, allowing the cooling solution to meet the demands of continuous operation. For optimal performance, compatibility with your specific Intel processor model should be checked, and case clearance verified prior to installation.

Actual product image Dynatron N12 Intel CPU Cooler 1U LGA4189-4-5 P4-P5 od P+ Cooler Copper with Vapour Chamber active with PW (26.30 mm)

Key specifications

Socket

A CPU socket or CPU slot is a mechanical component that provides mechanical and electrical connections between a microprocessor and a printed circuit board (PCB). This allows the CPU to be replaced without soldering.
Common sockets have retention clips that apply a constant force, which must be overcome when a device is inserted. For chips with a large number of pins, either zero-insertion force (ZIF) sockets or land grid array (LGA) sockets are used instead. These designs apply a compression force once either a handle (for ZIF type) or a surface plate (LGA type) is put into place. This provides superior mechanical retention while avoiding the risk of bending pins when inserting the chip into the socket.

Diameter

Number of fans

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

Airflow

The air volume refers to the amount of air that can be moved or circulated per unit of time. It is often measured in cubic metres per hour or litres per second. A higher air volume generally indicates a stronger suction force or circulation of air.

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