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Intel

The Intel Xeon Silver 4316 processor is a powerful solution for data centers, offering enhanced performance and energy efficiency. With 20 cores and 40 threads, this processor enables effective data processing and is ideal for applications that require high computing power. The clock frequency of 2.3 GHz can be boosted to up to 3.4 GHz through Turbo Boost, allowing for flexible adaptation to varying workloads. Support for DDR4 RAM and a maximum memory capacity of 6000 GB ensure that the processor operates efficiently even in memory-intensive environments. Additionally, the Xeon Silver 4316 offers a range of technologies that enhance security and virtualization, making it an excellent choice for modern IT infrastructures.

- Intel® Trusted Execution Technology for increased security
- Intel® Directed I/O Virtualization Technology (VT-d) to improve I/O device virtualization
- Intel® Virtualization Technology (VT-x) for utilizing multiple virtual platforms
- Maximum Turbo frequency of 3.4 GHz for flexible performance adjustment
- Octa-channel memory architecture for improved memory bandwidth.

Actual product image Intel Xeon Silver 4316 (LGA 4189, 2.30 GHz, 20 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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