The RS PRO thermal pad is a high-performance thermal interface material specifically designed for applications where efficient heat transfer is required. With a thermal conductivity of 1.6 W/m·K, this pad ensures that heat is quickly and effectively conducted from one component to another. Made from fiberglass, it not only offers excellent thermal performance but also high stability and durability. The thickness of 0.25 mm allows for easy integration into various devices and systems without increasing space requirements. With compact dimensions of 25.4 x 19 mm, this thermal pad is versatile and ideal for use in electronics, mechanical engineering, and other technical applications where reliable heat dissipation is crucial.

• Excellent thermal conductivity of 1.6 W/m·K
• Made from robust fiberglass for high stability
• Optimal thickness of 0.25 mm for versatile applications.