Name: SST-XE04-4189B - Xenon 4U small form factor server / workstation CPU cooler for Intel LG
Brand: Silverstone
SKU: 42601289
Price: 113 EUR
Availability: InStock

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Silverstone

CPU Cooler for Servers

- Five 6mm heat pipes
- PWM fan
- For Intel LGA 4189

Efficient Cooling with the SST-XE04-4189B CPU Cooler

The Silverstone SST-XE04-4189B CPU cooler offers outstanding cooling performance for your system. With efficient cooling technology and a powerful fan, this cooler keeps your CPU cool and efficient even under heavy loads. Experience improved system stability and performance through optimal cooling.

The Silverstone SST-XE04-4189B CPU cooler not only impresses with its cooling performance but also with its durable quality. Made from high-quality materials and with top-notch craftsmanship, this cooler is designed to withstand even the most demanding requirements. Rely on the reliability of this CPU cooler for long-lasting and stable system performance.

Technical Details

- Dimensions: 92 x 25 x 92 mm (W x H x D)
- Material: Copper (heat pipes), aluminum
- Weight: 786 g
- Color: Black
- Cooling performance: 270 W TDP
- Fan: max. 5,000 RPM, connection: 4-pin PWM
- Compatibility: Intel Socket LGA 4189.

Actual product image Silverstone SST-XE04-4189B - Xenon 4U small form factor server / workstation CPU cooler for Intel LG (126 mm)

Key specifications

Socket

A CPU socket or CPU slot is a mechanical component that provides mechanical and electrical connections between a microprocessor and a printed circuit board (PCB). This allows the CPU to be replaced without soldering.
Common sockets have retention clips that apply a constant force, which must be overcome when a device is inserted. For chips with a large number of pins, either zero-insertion force (ZIF) sockets or land grid array (LGA) sockets are used instead. These designs apply a compression force once either a handle (for ZIF type) or a surface plate (LGA type) is put into place. This provides superior mechanical retention while avoiding the risk of bending pins when inserting the chip into the socket.

Diameter

Number of fans

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

Airflow

The air volume refers to the amount of air that can be moved or circulated per unit of time. It is often measured in cubic metres per hour or litres per second. A higher air volume generally indicates a stronger suction force or circulation of air.

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