The Arctic TP-4 thermal pad is a high-quality, silicone-based solution designed for efficient heat dissipation in electronic components. With dimensions of 120x20 mm and a thickness of 0.5 mm, this pad is particularly suitable for applications where large or uneven gaps make the use of conventional thermal paste difficult. It bridges air gaps between heat sources, such as chips, and heat sinks to ensure optimal heat transfer. The extreme softness and compressibility of the pad allow it to compress up to 60% of its original thickness, making it a perfect fit for manufacturing tolerances and surface irregularities. Additionally, the TP-4 offers improved thermal transfer efficiency compared to the previous generation and can be used in stacks up to 2.0 mm thick without significant performance loss. Its electrical non-conductivity ensures maximum safety, while its ease of handling and high durability make it an ideal choice for various applications.

• Extreme softness and compressibility for optimal adaptation
• Improved thermal transfer efficiency compared to the previous generation
• Stackable up to 2.0 mm thickness without performance loss
• Electrically non-conductive for maximum safety.